One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

UV-curable acrylic for sealing and bonding glass to a variety of substrates. Typical applications are camera lens and housing bonding, low UV curing energy, excellent bond strength, excellent moisture resistance, and easy application in a variety of ways

UV-curable acrylic for PC sealing and bonding on a variety of materials, excellent bonding strength, excellent moisture resistance, easy to apply in a variety of ways

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

PW 2452-1 ist ein einkomponentiger, lösungsmittelfreier, UV-beheizter, dualhärtender Klebstoff auf Basis eines Acrylat-Hybridsystems mit ausgezeichneter Feuchtigkeitsbeständigkeit, Umgebungsalterung, Temperaturwäsche und Hoch- und Niedertemperaturwechseleigenschaften, ausgezeichneter Haftung auf einer Vielzahl von Substraten wie Kunststoffen, Glas, Metallen, thixotropen Eigenschaften und kontrollierbarer Fließfähigkeit

EW 6356-8, einkomponentiger, lösungsmittelfreier, thermisch härtender Klebstoff, Epoxidsystem, Es ist für die Erdung konzipiert, bei der Leitfähigkeit erforderlich ist. Typische Anwendungen sind CCM/Halbleiter

Typical Solutions