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Home > Produkte > Aushärtungsmethoden > Thermische Aushärtung

Thermische Aushärtung

Chemische Basis Acrylate Epoxide Silikone Polyurethane Andere

Aushärtungsmethoden UV Härtung Aushärtung durch Luftfeuchtigkeit Thermische Aushärtung 2-Komponenten Produkte Sonstige Produkte

Funktionen Strukturklebstoffe Verguss und Verkapselung Thermisch leitende Klebstoffe Elektrisch leitende Klebstoffe Sonstige Produkte

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Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

EW 6300M4-HV

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

PW 2452-1 ist ein einkomponentiger, lösungsmittelfreier, UV-beheizter, dualhärtender Klebstoff auf Basis eines Acrylat-Hybridsystems mit ausgezeichneter Feuchtigkeitsbeständigkeit, Umgebungsalterung, Temperaturwäsche und Hoch- und Niedertemperaturwechseleigenschaften, ausgezeichneter Haftung auf einer Vielzahl von Substraten wie Kunststoffen, Glas, Metallen, thixotropen Eigenschaften und kontrollierbarer Fließfähigkeit