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    Strukturklebstoffe

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    EW 6300M4B
    Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance
    EW 6300M4-HV
    Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance
    EW 6640HB
    Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways
    EW 6652
    Two-component epoxy, used for bonding or reinforcing electronic components, has excellent adhesion to a variety of substrates, optical transparency, low viscosity, good flowability, good waterproofing and aging resistance
    EW 6660HV
    Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways
    N-Sil 8511HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8512BT
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated
    N-Sil 8522BL(HQ)
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8522HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8522LD
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8522WL(HQ)
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8522WL(PO)
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8523
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523W
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523WL-2(HQ)
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
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