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    Sonstige Produkte

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    Prodktname
    Beschreibung
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    N-Sil 8462
    Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing
    N-Sil 8511HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8512BT
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated
    N-Sil 8522BL(HQ)
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8522HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8522LD
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8522WL(HQ)
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8522WL(PO)
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8523
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523W
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523WL-2(HQ)
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8530
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8530L
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8537P
    Modified silanes for sealing or bonding electronic components, easy to rework, no organotin, high initial bond strength, excellent shock or vibration resistance
    N-Sil 8539B
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
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