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    Verguss und Verkapselung

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    Funktionen Strukturklebstoffe Verguss und Verkapselung Thermisch leitende Klebstoffe Elektrisch leitende Klebstoffe Sonstige Produkte
    Prodktname
    Beschreibung
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    N-Sil 8522WL(PO)
    Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, no organotin, excellent resistance to moisture, high temperature and chemicals, and fast curing at room temperature
    N-Sil 8523
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523W
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8523WL-2(HQ)
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8530
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8530L
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8537P
    Modified silanes for sealing or bonding electronic components, easy to rework, no organotin, high initial bond strength, excellent shock or vibration resistance
    N-Sil 8539B
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539BH
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539E
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539G
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539HB
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539M
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539N
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
    N-Sil 8539S
    Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
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