Verguss und Verkapselung

Prodktname
Beschreibung
Ansicht
N-Sil 8539W
Modified silanes for sealing or bonding electronic components, organotin free, excellent adhesion to a wide range of substrates, good flowability, ease of use, excellent impact or vibration resistance
N-Sil 8551
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8551NT
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8551W
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8552
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8552HB
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8553
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8556
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8556F
Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength
N-Sil 8557C
Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance
N-PU 5612B
HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture
N-PU 5667(HQ)
HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing
PW 2452-1
PW 2452-1 ist ein einkomponentiger, lösungsmittelfreier, UV-beheizter, dualhärtender Klebstoff auf Basis eines Acrylat-Hybridsystems mit ausgezeichneter Feuchtigkeitsbeständigkeit, Umgebungsalterung, Temperaturwäsche und Hoch- und Niedertemperaturwechseleigenschaften, ausgezeichneter Haftung auf einer Vielzahl von Substraten wie Kunststoffen, Glas, Metallen, thixotropen Eigenschaften und kontrollierbarer Fließfähigkeit

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